THERMOELECTRIC DEVICE AND THERMOELECTRIC MODULE

A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts. 公开了种热电装置。热电装置包括：包括中空部的本体部，在中空部中设置有半导体装置；多个连接部，其在本体部的侧面上突出并且包括连接孔；以及多个电极部，连接到半导体装置并且延伸到连接部的连接孔。