ELECTRONIC DEVICE AND MULTILAYER CERAMIC SUBSTRATE

This electronic device comprises a substrate with an electronic component mounted thereon, wherein the electronic component is provided with a connection terminal on a mounting surface side thereof, the connection terminal being R-shaped when observed in cross-section view. This multilayer ceramic substrate comprises a surface electrode for connecting to the connection terminal, and is characterized in that: a recess is provided on a mounting surface of the multilayer ceramic substrate, the recess being R-shaped when observed in cross-section view and being formed at a position that corresponds to the connection terminal; and the surface electrode is provided to at least a portion of the recess, and is conductive with the connection terminal. 本发明的电子器件是在多层陶瓷基板安装有电子部件的电子器件，该电子器件的特征在于，上述电子部件在安装面侧具备在剖视下具有R形状的连接端子，上述多层陶瓷基板具备用于与上述连接端子连接的表面电极，在上述多层陶瓷基板的安装面，在与上述连接端子对应的位置形成有在剖视下具有R形状的凹部，上述表面电极设置在上述凹部的至少部分，并与上述连接端子导通。