METHOD FOR PRODUCING AT LEAST ONE ELECTRONIC MODULE ON A METAL RETAINER PLATE, INCLUDING AT LEAST ONE ELECTRICAL TEST
The invention relates to a method for producing an electronic module, which undergoes an electrical test, on a metal retainer plate (2). Prior to a final overmoulding step which shapes the outer contour of the electronic module, the following steps are carried out: an initial overmoulding step (8) l...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a method for producing an electronic module, which undergoes an electrical test, on a metal retainer plate (2). Prior to a final overmoulding step which shapes the outer contour of the electronic module, the following steps are carried out: an initial overmoulding step (8) limited to at least one electrical connection zone and also surrounding a section of a free end of ablank (6a) of a second insulating securing bar (6), thus producing an overmoulded non-conductive bridge (7) between them; separation of a first securing bar (5) from a component (11, 15) or element (4) so as to electrically insulate said at least one electrical connection zone; and electrical testing of the zone prior to the final overmoulding of the outer contour, wherein the electronic component(11, 15) or element (4) is secured rigidly to the second insulating securing bar (6) and to the retainer plate by means of said overmoulded bridge.
本发明涉及种用于在金属保持板(2)上制造经受电测试的电子模块的方法。在形成电子模块的外部外轮廓的最终覆膜成型之前,执行下列步骤:在所述至少个电连接区域处进 |
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