EPOXY-MODIFIED VINYL COPOLYMER, THERMOPLASTIC RESIN COMPOSITION CONTAINING SAME AND MOLDED ARTICLE OF SAID THERMOPLASTIC RESIN COMPOSITION
An epoxy-modified vinyl copolymer (A) which is composed of 0.1-95 parts by mass of an epoxy group-containing vinyl monomer and 5-99.9 parts by mass of one or more vinyl monomers selected from among aromatic vinyl monomers, vinyl cyanide monomers and other vinyl monomers that are copolymerizable with...
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Zusammenfassung: | An epoxy-modified vinyl copolymer (A) which is composed of 0.1-95 parts by mass of an epoxy group-containing vinyl monomer and 5-99.9 parts by mass of one or more vinyl monomers selected from among aromatic vinyl monomers, vinyl cyanide monomers and other vinyl monomers that are copolymerizable with the aromatic vinyl monomers or the vinyl cyanide monomers, and which has a weight average molecularweight Mw of from 50,000 to 300,000 and an epoxy equivalent weight of from 150 g/eq to 143,000 g/eq. A thermoplastic resin composition which contains this epoxy-modified vinyl copolymer (A) and a thermoplastic resin (C) such as a thermoplastic polyester resin (B). A molded article of this thermoplastic resin composition.
种环氧改性乙烯基系共聚物(A),其是由含环氧基乙烯基单体0.1~95质量份与选自芳香族乙烯基单体、氰化乙烯基单体以及可与它们共聚的其他乙烯基单体中的1种以上的乙烯基单体5~99.9质量份构成的共聚物,该共聚物的重均分子量Mw为50,000~300,000,环氧当量为150~143,000g/eq。包含该环氧改性乙烯基系共聚物(A)和热塑性聚酯树脂(B)等热塑性树脂(C)的热塑性树脂组合物。该热塑性树脂组合物的成型品。 |
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