BENDING DEVICE
Provided is a bending device of a simple configuration with which it is possible to perform bending processing while suppressing damage to the material being bent. The bending device 1 is equipped with a base portion 11 having an arcuate cross-section and having a moving surface 11a on which a mater...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Provided is a bending device of a simple configuration with which it is possible to perform bending processing while suppressing damage to the material being bent. The bending device 1 is equipped with a base portion 11 having an arcuate cross-section and having a moving surface 11a on which a material to be bent P is moved along the circumferential direction, and a plurality of bend correction plates 12 arranged to face the moving surface 11a with a predetermined distance therebetween and lined up side by side along the moving direction D of the material to be bent P.
本发明提供种弯曲加工装置,所述弯曲加工装置能够以简单的结构在抑制弯曲件破损的同时进行弯曲加工。弯曲加工装置(1)具备基座部(11)和若干个弯曲辅助板(12),所述基座部(11)具有截面呈圆弧状的移动面(11a),所述移动面(11a)用于使弯曲件(P)沿着所述移动面(11a)的圆周方向进行移动,所述若干个弯曲辅助板(12)配置成与所述移动面(11a)隔着规定间隔地相对,所述若干个弯曲辅助板(12)沿着所述弯曲件(P)的移动方向(D)并排设置。 |
---|