Positioned grinding device for machining of electronic product internal pipeline
The invention discloses a positioned grinding device for machining of an electronic product internal pipeline. The positioned grinding device comprises a workbench, a frame, a fixing rack and a workpiece barrel, wherein a first supporting frame is fixedly mounted at one end of the top of the workben...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a positioned grinding device for machining of an electronic product internal pipeline. The positioned grinding device comprises a workbench, a frame, a fixing rack and a workpiece barrel, wherein a first supporting frame is fixedly mounted at one end of the top of the workbench, a second supporting frame is mounted at the other end of the top of the workbench, a plurality of clamping rings are evenly mounted on the side, close to the second supporting frame, of the first supporting frame in the length direction, a plurality of clamping rings are also evenly connected tothe bottom of a pressing plate in the length direction, and the pressing plate is arranged over the workpiece barrel. Second oil cylinders are connected to two sides of the top of the second supporting frame, and clamping rings are connected to the ends, close to the first supporting frame, of the second oil cylinders. The positioned grinding device can machine the to-be-machined workpiece barreland fix the position of t |
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