Single-wire temperature-change-resistant enclosing structure monitoring device and enclosing structure displacement measuring method

The present invention discloses a single-wire temperature-change-resistant enclosing structure monitoring device and an enclosing structure displacement measuring method, and relates to the technicalfield of monitoring. The single-wire temperature-change-resistant enclosing structure monitoring devi...

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Bibliographische Detailangaben
Hauptverfasser: LI SHIZHAN, JIANG SIJUN, LU SHICAI, LI HAORAN, XU SHENGQUAN, YU ZHENGZHONG, HAN GUOQING, DU CAO, YAN ZEHONG, GUI PENG, WANG JIANBIN, LI LIANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention discloses a single-wire temperature-change-resistant enclosing structure monitoring device and an enclosing structure displacement measuring method, and relates to the technicalfield of monitoring. The single-wire temperature-change-resistant enclosing structure monitoring device comprises a displacement measuring assembly and a temperature-change offset assembly; the displacement measuring assembly comprises a steel wire and a steering piece arranged away from an enclosing structure, one end of the steel wire is connected with the enclosing structure, the other end of the steel wire passes through the steering piece and vertically sinks, a weight is tied at the end of the vertically-sunken part of the steel wire, and a vertical measuring rule is arranged on one sideof the vertically-sunken part of the steel wire; and a temperature-change gauge fixed to the vertically-sunken part of the steel wire serves as the temperature-change offset assembly, the temperature-change gauge comprises a