Semiconductor laser processing device

The invention relates to a semiconductor laser processing device. The semiconductor laser processing device comprises a laser cutting mechanism, a laser cracking mechanism and a driving mechanism, wherein the laser cutting mechanism comprises a first laser device and a first laser shaper; a first laser beam emitted from the first laser device is subjected to collimation and focusing processing through the first laser shaper to conduct laser cutting on a workpiece; the laser cracking mechanism comprises a second laser device and a second laser shaper; a second laser beam emitted from the secondlaser device is shaped into at least two focused parallel beams to conduct cracking on the laser cut position of the workpiece; and the driving mechanism drives the workpiece to the corresponding processing position. The semiconductor laser processing device can cut a semiconductor device more smoothly without obvious edge breakage and residue splashing. 本发明涉及种半导体激光加工装置，包括：激光切割机构，包括第激光器和第激光整形器，所述第激光器发射的第激光光束经所述第激光整形器准直、聚