Manufacturing method for KU-band high-gain amplifier

The invention provides a manufacturing method for a KU-band high-gain amplifier. The amplifier comprises an amplifier casing, and is manufactured through the following steps: S1, sintering of a radiofrequency (RF) circuit board, which comprises S11 - lamination, S12 - mounting of the RF circuit boar...

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Bibliographische Detailangaben
Hauptverfasser:	LI JINJING, CHEN XINGSHENG, WANG LUNYUAN, YU CHANG, FEI WENJUN, ZHOU ERFENG, CHEN FULI, ZHU LIANGFAN, CAI QINGGANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention provides a manufacturing method for a KU-band high-gain amplifier. The amplifier comprises an amplifier casing, and is manufactured through the following steps: S1, sintering of a radiofrequency (RF) circuit board, which comprises S11 - lamination, S12 - mounting of the RF circuit board, S13 - mounting of insulators, and S14 - sintering of an assembly obtained through the mounting;S2, sintering of core components, which comprises S21 - surface-mounting of the components, and S22 - sintering of an assembly obtained through the surface-mounting; S3, cleaning of the sintered amplifier casing with the components, wherein the sintered amplifier casing with the components is cleaned through a vapor-phase cleaning machine; and S4, assembly, which comprises S41 - lead interconnection, S42 - connector assembly, and S43 - cover plate fixation. 本发明提供了种KU波段高增益放大器的制作方法，包括放大器壳体，所述放大器的制作步骤如下：S1：射频电路板烧结---S2：核心元器件烧结---S3：烧结的元器件放大器壳体进行清洗---S4：装配；在步骤S1中，需要进行S11：贴膜---S12：装射频电路板---S13：装绝缘子---S14：烧结装配组件；在步骤S2中，需要进行S