Short-time heating high-power device packaging structure and method

The invention relates to a short-time heating high-power device packaging structure and method and belongs to the technical field of semiconductor packaging. The packaging structure comprises a high-power device and a packaging shell; the packaging shell is divided into a shell upper layer and a shell lower layer, the shell upper layer is a closed cavity, the high-power device is arranged at the bottom of the cavity through an insulating substrate, a lead of the high-power device is led out from the side wall of the shell upper layer; the shell lower layer is a metal entity, a plurality of hollow chambers are arranged in the metal entity, and a phase change material is filled in the hollow chambers. The high-power device adopting the packaging structure does not need to be installed on a structural part close to a heat sink; when the high-power device operates, the phase change material can absorb the heat generated during high-power operation in a short time so that the temperature ofthe component is enabled