Package structure of visible light communication LED chip array

The invention discloses a package structure of a visible light communication LED chip array. The package structure comprises a substrate, a visible light communication chip and fluorescent glue. The substrate includes a solder resist layer, a pad layer, a line layer, a reflective layer, an insulating layer and a substrate layer from top to bottom. The package structure is a visible light communication chip fixed at the center of the upper surface of the substrate, the visible light communication chip is electrically connected to the pad through the bonding wire, and the fluorescent glue coversthe upper surface of the chip by fixing dispensing positions through a box dam. The visible light communication chip is a positive-loading blue chip, is provided with a plurality of electrodes at thesurface, and is provided with a plurality of light-emitting units. The package structure of a visible light communication LED chip array can make the connection of the chip and the external circuit drive much simpler and more