Laser cutting method and device

The invention discloses a laser cutting method and device. The laser cutting method comprises the steps that and a substrate is provided, and the substrate includes an intermediate layer, an upper coating layer arranged on the upper surface of the intermediate layer, and a lower coating layer arranged on the lower surface of the intermediate layer; the upper coating layer or the lower coating layer in a laser cutting area of the substrate is cleaned to form an upper exposed area or a lower exposed area; Laser irradiates into the laser cutting area of the substrate and cuts the substrate alongcutting paths to form a finished product. Before laser cutting is carried out, the upper coating layer or the lower coating layer in the laser cutting area of the substrate is cleaned firstly, and then the laser irradiating into the laser cutting area of the substrate and cutting the substrate to form the finished product is carried out. During the whole process, the dust generated during the laser cutting is correspondin