Surface mount semiconductor device and method of manufacture

The invention describes a surface mount semiconductor device and a method of manufacture. A semiconductor die is mounted on a first support surface; a leadframe is attached to the semiconductor die, the leadframe comprising: an electrical lead having a first lead region connected to the semiconductor die; and a second lead region distal the first lead region, wherein the second lead region is connected to a second support surface; encapsulating the semiconductor die, first support surface and the first lead region; the second lead region is severed from the second support surface to expose a lead end; and the second lead region is electro-plated with a metallic material, such that the lead end is coated with the metallic material. 本发明描述表面安装半导体器件及其制造方法。在第支撑表面上安装半导体裸片；将引线框架附接到半导体裸片，引线框架包括：电气引线，其具有连接到半导体裸片的第引线区域；和在第引线区域远端的第二引线区域，其中，第二引线区域连接到第二支撑表面；封装半导体裸片，第支撑表面和第引线区域；从第二支撑表面断开第二引线区域以暴露引线端部；以及利用金属材料电镀第二引线区域，使得引线端部涂覆有所述金属材料。