Method and curable compound for casting electronic components or component groups

The invention relates to a method for casting electronic components, wherein the components (1) are embedded in a casting compound (4) and the casting compound (4) is then cured via at least one cross-linking process. The invention further relates to a curable compound which can be used as a casting compound (4) in the method. The casting compound (4) contains at least one cross-linked component,which is homogeneously distributed in the casting compound (4) and can cross-link to at least two different cross-linked systems. A first of said cross-linked systems (8) has a higher cross-link density than a second network (7), wherein the cross-linking to the first cross-linked system (8) is triggered via a different event than the cross-linking to the second cross-linked system (7). When casting the components (1) or component groups, the at least one cross-linked component of the casting compound (4) is then cured at least in part to the first cross-linked system (8), in at least one first region (5), which is sp