DEVICE FOR VERTICAL GALVANIC METAL DEPOSITION ON A SUBSTRATE

The present invention is related to a device for vertical galvanic metal, preferably copper, deposition on a substrate comprising at least a first device element and a second device element, which arearranged in a vertical manner parallel to each other; wherein the first device element comprises at least a first anode element having a plurality of through-going conduits and at least a first carrier element having a plurality of throughgoing conduits; wherein said at least first anode element and said at least first carrier element are firmly connected to each other; wherein the second deviceelement comprises at least a first substrate holder which is adapted to receive at least a first substrate to be treated, wherein said at least first substrate holder is at least partially surroundingthe at least first substrate to be treated along its outer frame after receiving it, wherein the at least first device element further comprises a plurality of plugs, wherein each plug comprises at least a through-going channe