Electroplating wastewater treatment device

The invention discloses an electroplating wastewater treatment device which comprises a sedimentation tank, wherein a water inlet is arranged at the top of the sedimentation tank; a real-time samplingand analyzing device is arranged at the water inlet; a water outlet is arranged at the bottom of the sedimentation tank; the water outlet is connected with a first water pipe; a flow measuring deviceis arranged on the first water pipe; a reducing pool comprises a reducing pool casing and sub-reducing pools; the sub-reducing pools are rotatable; water outlets are respectively arranged below the sides of the reducing pool casing and the sub-reducing pools; the water outlets of the sub-reducing pools are matched with the water outlet below the side of the reducing pool casing; a feeding deviceis arranged on the reducing pool; and the feeding amount is controlled by a control module. Compared with a conventional method, the electroplating wastewater treatment device has the benefits that the real-time sampling and an