Customizable headphone audio driver assembly, headphone and related method

The invention relates to customizable headphone audio driver assembly, headphone and related method. Headphones include removable audio drivers electrically coupled with electrical conductors using solderless and detachable interconnections. Driver assemblies for headphones include an audio driver and a driver unit housing. An acoustical cavity is defined between the driver unit housing and the audio driver, and a port extends through the driver unit housing between the acoustical cavity and the exterior of the driver assembly. The driver unit housing is configured to be secured within an outer ear-cup housing of a headphone such that the port is open to the exterior of the headphone without communicating acoustically with a volume outside the driver unit housing and within the outer ear-cup housing. Headphones include such driver assemblies. Methods are used to form such headphones and driver assemblies. 本发明涉及可定制的耳机音频驱动器组件、耳机以及有关的方法。耳机包括通过无焊接的并且可拆开的互相连接方式与电导体电联接的可拆卸的音频驱动器。用于耳机的驱动器组件包括音频驱动器以及驱动器单元壳体。在该驱动器单元壳体