SEMICONDUCTOR DEVICE

Provided is a technique for improving product attachment. The distance between the lower end of the main body portion (3a) and the lower end of the casing (10) in a state where the semiconductor device fastens the screw (12) to the heat sink (1) via one mounting hole (14b, 14d) is set as M, the swel...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OKADA KAZUYA, MASUDA KOICHI, MURAOKA HIROKI, IZUMI SHOJI, SHIMIZU YASUTAKA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Provided is a technique for improving product attachment. The distance between the lower end of the main body portion (3a) and the lower end of the casing (10) in a state where the semiconductor device fastens the screw (12) to the heat sink (1) via one mounting hole (14b, 14d) is set as M, the swelling amount of the swelling portion (3b) is W, and the projection height of the convex portion (11b)is T, the distance in the horizontal direction from the outer peripheral end of the casing (10) to the outer periphery of the heat dissipation plate (3) is L. The angle A formed by the imaginary line(B-B') and the imaginary line (C-C') satisfies 0