Packaging method of multi-point near-distance inductor

The invention discloses a packaging method of a multi-point near-distance inductor. The method comprises the following steps: a PCB substrate preparation step, an inductor chip preparation step, an assembling step, a curing step and a lead bonding step. In the assembling step, an inductor chip is ar...

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Bibliographische Detailangaben
Hauptverfasser:	RAO GAN, QIN YAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ANALOGOUS ARRANGEMENTS USING OTHER WAVES BASIC ELECTRIC ELEMENTS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	The invention discloses a packaging method of a multi-point near-distance inductor. The method comprises the following steps: a PCB substrate preparation step, an inductor chip preparation step, an assembling step, a curing step and a lead bonding step. In the assembling step, an inductor chip is arranged in an inductor chip optical design position of a PCB substrate through a chip mounting process, and a pre-prepared VCSEL chip is arranged on a VCSEL chip metal platform of the PCB substrate through the chip mounting process; in the curing step, the PCB substrate pasted with the VCSEL chip andthe inductor chip is placed into an oven, and the baked chips and the PCB substrate are firmly combined; and in the lead bonding step, the VCSEL chip and the inductor chip are connected with the PCBsubstrate through gold wires and an ultrasonic welding technology to form a multi-point near-distance inductor module. According to the method provided by the invention, the packaging of the multi-point near-range inductor can