Thermosetting resin composition, and prepreg and substrate using same

The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepregand a printed circuit board using the same, wherein the thermosetting resin composition can be used...

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Bibliographische Detailangaben
Hauptverfasser:	CHO HEE JIN, NAM SAE ROM, SUNG DO KYUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepregand a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously exhibits excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability. 本发明涉及种热固性树脂组合物、使用该热固性树脂组合物的预浸料和印刷电路板，更具体地，涉及种热固性树脂组合物以及使用该热固性树脂组合物的预浸料和印刷电路板，其中，所述热固性树脂组合物可以用于印刷电路板，该印刷电路板同时具有优异的低介电损耗特性、良好的吸湿耐热性、低热膨胀特性以及热稳定性。