INTEGRATED FAN-OUT PACKAGE

An integrated fan-out package includes a first redistribution structure, a die, an encapsulant, a plurality of conductive structures, and a second redistribution structure. The first redistribution structure has a first surface and a second surface opposite to the first surface. The die is disposed over the first surface of the first redistribution structure and is electrically connected to the first redistribution structure. The encapsulant encapsulates the die. The conductive structures are disposed on the first surface of the first redistribution structure and penetrate the encapsulant. Theconductive structures surround the die. The second redistribution structure is disposed on the encapsulant and is electrically connected to the first redistribution structure through the conductive structures. The second redistribution structure includes at least one conductive pattern layer that is in physical contact with the encapsulant. 种集成扇出型封装包括第重布线结构、管芯、包封体、多个导电结构及第二重布线结构。所述第重布线结构具有第表面及与所述第表面相对的第二表面。所述管芯设置在所述第重布线结