Silicon wafer coating and pre-alignment detecting device and method

The invention provides a silicon wafer coating and pre-alignment detecting device and method. A detection device is added in lithography equipment, thickness and uniformity detection and pre-alignmentdetection of silicon wafer coating are completed in centering adjustment and directional adjustment...

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Hauptverfasser: SUN LUGANG, DU YANWEI, ZHENG JIAOZENG, WANG GANG, PANG FEI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a silicon wafer coating and pre-alignment detecting device and method. A detection device is added in lithography equipment, thickness and uniformity detection and pre-alignmentdetection of silicon wafer coating are completed in centering adjustment and directional adjustment of an internal silicon wafer of the lithography, so that thickness and uniformity of silicon wafercoating are detected while working processes of the lithography equipment are not increased and equipment investment is reduced, and the yield rate and detection efficiency of silicon wafer coating are improved. 本发明提供了种硅片涂胶及预对准检测装置及方法,通过在光刻机设备内部增加检测装置,在所述光刻机内部硅片的定心调节和定向调节中完成对硅片涂胶的厚度和均匀度的检测以及预对准检测,实现了在不增加光刻机设备工作流程和减少设备投入的条件下对硅片涂胶厚度和均匀性的检测,提高了硅片涂胶的良品率和检测效率。