BENZOXAZINE-BASED MIXTURE AND USE THEREOF

The present invention relates to a benzoxazine-based mixture and a use thereof and, more specifically, to a benzoxazine-based mixture and a use of a cured product in which the benzoxazine-based mixture is cured, wherein the benzoxazine-based mixture has high dielectric characteristics, heat resistan...

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Bibliographische Detailangaben
Hauptverfasser: NAM SAE ROM, CHO HEE JIN, SUNG DO KYUNG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The present invention relates to a benzoxazine-based mixture and a use thereof and, more specifically, to a benzoxazine-based mixture and a use of a cured product in which the benzoxazine-based mixture is cured, wherein the benzoxazine-based mixture has high dielectric characteristics, heat resistant characteristics, and flame retardant characteristics by comprising a benzoxazine ring in a molecular structure, and thus can be applied to a sealing material, a molding material, a template material, an adhesive, a material for an electric insulation paint, and the like, which are used for a copper clad laminate or an electronic part, used in a printed circuit board. 本发明涉及种苯并噁嗪类混合物及其用途,更具体地,涉及种苯并噁嗪类混合物和由该苯并噁嗪类混合物固化而成的固化产物的用途,其中,所述苯并噁嗪类混合物通过在分子结构中包含苯并噁嗪环而具有高的介电特性、耐热特性和阻燃特性,因此,可以应用于在印刷电路板中使用的铜箔层压板或电子零件所使用的密封材料、模塑材料、模板材料、粘合剂、电绝缘涂料用材料等。