Process for manufacturing non-spacing typeset printed circuit boards by utilizing ultraviolet (UV) cutting

The invention discloses a process for manufacturing non-spacing typeset printed circuit boards by utilizing ultraviolet (UV) cutting. The method comprises the following steps of: 1) forming holes in asubstrate by utilizing the UV cutting and electroplating through holes and the whole board; 2) carry...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	LIN MUQUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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