Process for manufacturing non-spacing typeset printed circuit boards by utilizing ultraviolet (UV) cutting

The invention discloses a process for manufacturing non-spacing typeset printed circuit boards by utilizing ultraviolet (UV) cutting. The method comprises the following steps of: 1) forming holes in asubstrate by utilizing the UV cutting and electroplating through holes and the whole board; 2) carrying out soldering-proof treatment on the whole board; 3) carrying out surface treatment on the whole board; 4) carrying out character printing on the whole board; 5) carrying out UV laser cutting and forming; and 6) carrying out the subsequent manufacturing processes. The process disclosed by the invention has the beneficial effects that by utilizing the UV laser cutting and forming, the utilization rate of the substrate is increased, the production efficiency is improved and the production cost is reduced; and compared with the prior art, the process has the advantages that the process flow is further optimized, the uniformity and the levelling property of soldering-proof ink and the surface flatness, the wear res