CHIP ON GLASS PACKAGE ASSEMBLY

A chip on glass package assembly includes a glass substrate, a first type chip, a second type chip and a plurality of connecting lines. The glass substrate includes an active area and a peripheral area connected to the active area. The first type chip is mounted on the peripheral area and including a processor. The second type chip is mounted on the peripheral area and located on a side of the first type chip, wherein the second type chip is different from the first type chip. The connecting lines are disposed on the peripheral area and connecting the first type chip and the second type chip. 本发明公开种玻璃芯片接合封装组件，包括玻璃衬底、第类芯片、第二类芯片和多个连接线。玻璃衬底包括有源区域和与有源区域连接的周边区域。第类芯片设置于周边区域上，且包括处理器。第二类芯片设置于周边区域上，且位于第类芯片的侧上，其中，第二类芯片不同于第类芯片。连接线配置于周边区域上，且连接第类芯片和第二类芯片。