Three-dimensional packaging method with surface protection effect

The invention discloses a three-dimensional packaging method with a surface protection effect. An element and a lead bridge are assembled to a PCB; one ends of a plurality of pins are connected through resin pouring and sealing to obtain a bottom plate; laminated plates and the bottom plate are arranged on a jig; the laminated plates are arranged in a layered mode in the vertical direction up anddown; resin is poured and sealed between every two adjacent layers of plates, and after the resin is solidified and formed, cutting is carried out according to the designed size of a chip, and the section of the laminated plate lead bridge is exposed out of the side surface; the side surface is subjected to metal plating, and a metal plating layer is engraved, and then line connecting and formingare performed; and surface painting is carried out to form the side surface of a module III, and the top surface is painted. The chip obtained by packaging is compact in internal structure, high in electrical connection and hi