MEMS DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

A Micro Electro-Mechanical System (MEMS) device package includes a first circuit layer, a partition wall, a MEMS component, a second circuit layer and a polymeric dielectric layer. The partition wallis disposed over the first circuit layer. The MEMS component is disposed over the partition wall and electrically connected to the first circuit layer. The first circuit layer, the partition wall andthe MEMS component enclose a space. The second circuit layer is disposed over and electrically connected to the first circuit layer. The polymeric dielectric layer is disposed between the first circuit layer and the second circuit layer. 种微机电系统MEMS装置封装包含第电路层、分隔壁、MEMS组件、第二电路层和聚合性电介质层。所述分隔壁安置在所述第电路层上。所述MEMS组件安置于所述分隔壁上，且电连接到所述第电路层。所述第电路层、所述分隔壁和所述MEMS组件围封空间。所述第二电路层安置于所述第电路层之上，且电连接到所述第电路层。所述聚合性电介质层安置于所述第电路层与所述第二电路层之间。