Improved three-dimensional packaging method

The invention discloses an improved three-dimensional packaging method. A component and lead bridges are assembled to a PCB board. One end of a number of pins is connected through resin potting to acquire a bottom plate. Laminated plates and the bottom plate are clamped on a jig. The laminated plates are vertically arranged up and down in layers. Resin is potted between two adjacent laminated plates. After resin is cured and molded, cutting is carried out according to the boundary dimension of a designed chip. The cross sections of the lead bridges of the laminated plates are exposed on the side. Metal plating, metal plating engraving and wire connection molding are carried out on the side. Second potting molding is carried out, and resin is potted at the side and top of a third molded module. Miniaturization and high integration are realized, and at the same time a metal plating is not exposed on the outer surface of a module and is protected. Even if the surface of a module is scraped, the interconnection m