Semiconductor package device and method of manufacturing same

A semiconductor package device comprises a substrate, an electrical component and a package body. The electrical component is disposed on the substrate. The electrical component has an active surfacefacing toward the substrate and a back surface opposite to the active surface. The back surface has a first portion and a second portion surrounding the first portion. The first portion of the back surface of the electrical component includes a plurality of pillars. The package body is disposed on the substrate. The package body encapsulates the electrical component and exposes the back surface ofthe electrical component. 种半导体封装装置包括衬底、电组件及封装主体。所述电组件设置在所述衬底上。所述电组件具有面朝所述衬底的有源表面及与所述有源表面相反的背表面。所述背表面具有第部分及围绕所述第部分的第二部分。所述电组件的所述背表面的所述第部分包括多个柱。所述封装主体设置在所述衬底上。所述封装主体包封所述电组件并且暴露所述电组件的所述背表面。