LIQUID PROCESSING APPARATUS

The invention provides a technique for suppressing adhesion of particles to a substrate in a liquid processing apparatus that performs a liquid processing by supplying a processing liquid to the substrate. The liquid processing apparatus is configured such that when the processing fluid is supplied from nozzles (5, 6, 7) to a wafer (W) held horizontally, a cover member (15) of moving opening portions (16a, 16b, 16c) for moving the nozzles (5, 6, 7) covers moving bases (54, 64, 74) and guide rails (55, 65, 75); a drive region under the cover member (15) is exhausted; the moving bases (54, 64, 74) are used to move each nozzle portion (5, 6, 7) between the wafer and the standby position. Further, when the nozzle portions are placed at the standby position, the openings (16a, 16b, 16c) are closed by nozzle arms (52, 62, 72) of the respective nozzle portions. 本发明提供种在将处理液供给到基片进行处理的液处理装置中，抑制颗粒向基片的附着的技术。上述液处理装置构成为，在从各喷嘴部(5、6、7)对保持为水平的晶片(W)供给处理流体进行处理时，由设置有用于使各喷嘴部(5、6、7)移动的开口部(16a、16b、16c)的覆盖部件(15)覆盖移动基台(54、64、74)和导轨(5