Circuit feed-through and mounting and sealing structure thereof

The invention relates to a circuit feed-through and a mounting and sealing structure thereof and belongs to the technical field of electronic component sealing structures. An insulating material fillsthe portion between the inner part of a metal sleeve and an electrode; low-temperature glue, middle-temperature glue and high-temperature glue are arranged in sequence from the center of the metal sleeve to the outside; a mounting pore channel for mounting the circuit feed-through is a pore channel with different upper and lower pore diameters; the pore channel part with a small pore diameter ismatched with the outer diameter of the metal sleeve; the pore channel part with a large pore diameter is located at an atmosphere contact end; the diameter of the pore channel part with the large porediameter is greater than the outer diameter of the metal sleeve and a gap is formed between the pore channel part with the large pore diameter and the metal sleeve; a sealing element is poured and into and fills the gap; and l