USE OF MOULDING COMPOUNDS BASED ON BLENDS OF SAN-COPOLYMERS AND POLYAMIDE FOR 3D PRINTING

The invention relates to the use of a thermoplastic moulding compound for 3D Printing, made of a mixture of the following components A - E: A: 35 - 60 wt.% impact resistant modified polymer A comprising: 30 - 95 wt.% SAN-copolymer and 5 - 70 wt.% ABS-graft copolymer; B: 33 - 58 wt.% aliphatic polyam...

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Bibliographische Detailangaben
Hauptverfasser: NIESSNER NORBERT, BAUMANN STEPHANIE, SCHMIDT HANS-WERNER, EISENTRAGER FRANK, MEINERS JOSEF
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to the use of a thermoplastic moulding compound for 3D Printing, made of a mixture of the following components A - E: A: 35 - 60 wt.% impact resistant modified polymer A comprising: 30 - 95 wt.% SAN-copolymer and 5 - 70 wt.% ABS-graft copolymer; B: 33 - 58 wt.% aliphatic polyamide B; C: 1 -10 wt.% SANMSA-terpolymer C as a compatibilizing agent; D: 0.01 - 5 wt.% processing agent D; and E: 0 - 30 wt.% other additives E. 本发明涉及用于3D打印的热塑性模塑料的用途,其由以下组分A-E的混合物制成:A:35-60重量%抗冲击改性聚合物A,其包含:30-95重量%的SAN共聚物和5-70重量%的ABS接枝共聚物;B:33-58重量%的脂族聚酰胺B;C:1-10重量%的SANMSA三元共聚物C作为相容剂;D:0.01-5重量%的助剂D;和E:0-30%重量%的其他添加剂E。