Semi-solidified epoxy glue film as well as preparation method and use thereof

The invention relates to a semi-solidified epoxy glue film as well as a preparation method and use thereof, in particular to a semi-solidified heat-fusion method low-temperature epoxy glue film and apreparation and use method thereof. Through a semi-solidifying method, a flexible chain section is added into an epoxy resin molecular chain, and a heat-fusion method is used for preparing the epoxy glue film which is suitable for being applied to a low-temperature environment, and a preparation and use method of the epoxy glue film. The low-temperature epoxy glue film is suitable for preparing asandwich structure and a glue joint structure under a the low-temperature environment. The semi-solidified epoxy glue film can be applied to the fields such as low-temperature wind tunnel blades, low-temperature composite material storage boxes and, low-temperature super-conduction, and the low-temperature is a temperature -150 DEG C or less. 本发明涉及种半固化环氧胶膜及其制备方法和使用，具体涉及种半固化热熔法低温环氧胶膜及其制备使用方法，通过半固化法在环氧树脂分子链中引入柔性链段，再通过热熔法制备适宜