Chip processing method and chip spliced board
The present invention discloses a chip processing method. The method includes the following steps that: a chip spliced board is provided, wherein the chip spliced board comprises a package housing, wherein the package housing is provided with a spray surface, and an inclined surface connected with t...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention discloses a chip processing method. The method includes the following steps that: a chip spliced board is provided, wherein the chip spliced board comprises a package housing, wherein the package housing is provided with a spray surface, and an inclined surface connected with the spray surface; the chip spliced board is arranged on the carrier of a spraying device; the spraysurface of the chip spliced board is sprayed with a spraying material, so that a spray layer can be formed, and the excess spraying material flows along the inclined surface to the carrier. The invention provides a chip spliced board. With the chip processing method adopted, the unevenness of ink during a spraying process can be avoided, and a spraying effect is better.
本发明公开了种芯片加工方法,所述方法包括:提供芯片拼板,所述芯片拼板包括封装外壳,所述封装外壳设置有喷涂面、以及自所述喷涂面连接的倾斜面;将所述芯片拼板放置于喷涂设备的承载体;使用喷涂材料对所述芯片拼板喷涂面进行喷涂,形成喷涂层,以使多余喷涂材料沿倾斜面流向所述承载体。还有提供了种芯片拼板。本发明的有益效果在于:在喷涂过程中不会产生油墨不均匀的情况,喷涂效果更好。 |
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