Chip processing method and chip spliced board

The present invention discloses a chip processing method. The method includes the following steps that: a chip spliced board is provided, wherein the chip spliced board comprises a package housing, wherein the package housing is provided with a spray surface, and an inclined surface connected with the spray surface; the chip spliced board is arranged on the carrier of a spraying device; the spraysurface of the chip spliced board is sprayed with a spraying material, so that a spray layer can be formed, and the excess spraying material flows along the inclined surface to the carrier. The invention provides a chip spliced board. With the chip processing method adopted, the unevenness of ink during a spraying process can be avoided, and a spraying effect is better. 本发明公开了种芯片加工方法，所述方法包括：提供芯片拼板，所述芯片拼板包括封装外壳，所述封装外壳设置有喷涂面、以及自所述喷涂面连接的倾斜面；将所述芯片拼板放置于喷涂设备的承载体；使用喷涂材料对所述芯片拼板喷涂面进行喷涂，形成喷涂层，以使多余喷涂材料沿倾斜面流向所述承载体。还有提供了种芯片拼板。本发明的有益效果在于：在喷涂过程中不会产生油墨不均匀的情况，喷涂效果更好。