Power-frequency-tolerant arc-extinguishing packaged piezoresistor and packaging method thereof

A power-frequency-tolerant arc-extinguishing packaged piezoresistor and a packaging method thereof are provided. A pressure-sensitive chip is pacakaged from outside via a combination of insulating plastic and an anti-arc material; alternatively, the pressure-sensitive chip is externally covered with an insulating conformal layer and is then covered with insulating plastic and anti-arc mixture; alternatively, after packaging above is complete, a sand-fixing protective layer applied outside for packaging. The anti-arc material is preferably quartz sand or silanized quartz; the insulating material is preferably epoxy resin, silicone resin, silicon resin or silicone rubber. The quartz sand is fixed in position, and the quartz sand has a softening temperature lower than a melting point of a zinc oxide pressure-sensitive device; SiO2 that is molten during pressure-sensitive chip degradation can repair the pressure-sensitive device and block its degradation. A pressure-sensitive device pacakaged herein has greatly i