SEMICONDUCTOR PACKAGE WITH NICKEL PLATING AND METHOD OF FABRICATION THEREOF

A method for fabricating a semiconductor package includes providing a substrate, at least partially encapsulating the substrate in an encapsulation body, and depositing by electroplating a first Ni layer on a first surface of the substrate. A second Ni layer by electroless Ni plating is deposited on the first Ni layer. 种用于制造半导体封装的方法包括提供衬底，至少部分地将衬底包封在包封体中，通过电镀在所述衬底的第表面上沉积第Ni层，以及通过无电镀Ni在第Ni层上沉积第二Ni层。