hole wall metallization method for improving the reliability of a printed circuit board

The invention discloses a hole wall metallization method for improving the reliability of a printed circuit board, which comprises the following steps: drilling holes on a production board; Then the copper layer in the inner layer of the hole is etched by micro-etching, so that there is a step drop between the copper layer and the dielectric layer in the hole. The holes are then metallized by sinking copper and electroplating the whole plate. A smooth, uniform and highly reliable pore wall cop plating lay can be obtained by adopting that method of the invention, At that same time, the stress point are not formed at the interface, the problem that the hole wall roughness and the crack stress of the cop plating layer are easily caused by the concave etching proces at present are avoided, thereliability of the circuit board is improved, and the high reliability requirements of aerospace, military and other products are met. 本发明公开了种提高印制电路板可靠性的孔壁金属化方法，包括以下步骤：在生产板上钻孔；而后通过微蚀蚀刻孔内的内层线路铜层，使孔内的内层线路铜层与介质层之间存在阶梯落差；然后通过沉铜、