novel surface mount circulator and an encapsulation method
The invention discloses a novel surface mount circulator and an encapsulation method. The surface mount circulator comprises an annulator substrate, a permanent magnet, a surface circuit arranged on the annulator substrate, three ports, an upper shielding plate and a lower shielding plate, wherein t...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a novel surface mount circulator and an encapsulation method. The surface mount circulator comprises an annulator substrate, a permanent magnet, a surface circuit arranged on the annulator substrate, three ports, an upper shielding plate and a lower shielding plate, wherein the upper shielding plate is U-shaped with the opening downward, the lower shielding plate is U-shaped with the opening upward, and the two are staggered to form a shielding shell; Circuit match holes are respectively arrange in corresponding ports of that annulus substrate, and metallized circular or square pads are arrange at matching holes on the upper and lower surfaces of the annulus substrate. The traditional microstrip circulator is difficult to assemble with the whole system, By adding metallized vias, bottom circuit and metal enclosure packaging, the technical problems of traditional microstrip circulator are solved, and the miniaturization and integration of the system are realized.There is no electromagne |
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