Backlight module, panel comprising same, and manufacturing method of backlight module

The invention discloses a backlight module, a panel comprising the same, and a manufacturing method of the backlight module. The backlight module comprises a light emitting unit, an adhesive layer, and an optical film layer. The light emitting unit is covered on the adhesive layer. The optical film...

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Bibliographische Detailangaben
Hauptverfasser: CHEN YANNIAN, CHEN ZHITIAN, LIANG HUIHUNG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a backlight module, a panel comprising the same, and a manufacturing method of the backlight module. The backlight module comprises a light emitting unit, an adhesive layer, and an optical film layer. The light emitting unit is covered on the adhesive layer. The optical film layer is arranged on the adhesive layer. The adhesive layer is arranged between the optical film layer and the light emitting unit. The light emitting unit is a light emitting diode, which is a sub-millimeter light emitting diode or a micro light emitting diode. The size of the light emitting diodeis less than 500 millimeters. The light emitting diode is covered by the adhesive layer and the optical film layer, is protected, and is not exposed to the air directly. Due to the special optical design of the adhesive layer or/and the optical film layer, the optical characteristics of the light emitting diode are improved. 本发明有关于种背光模块及应用其的面板及其制造方法。背光模块,包括:发光单元、黏着层以及光学膜层。黏着层覆盖发光单元。光学膜层位于黏着层上,其中黏着层是设置于光学膜层与发光单元之间。发光单元为发光二