A composite encapsulation method for LED display

The invention discloses a composite packaging method for LED display. The packaging method comprises six steps of chip fixing and bonding wire electrical connection, plastic sealing, glue removing, pin cutting ribs and stamping forming. The small volume SOT23-6, and a highly assembled LED lamp bead...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MEN HONGDA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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