A composite encapsulation method for LED display

The invention discloses a composite packaging method for LED display. The packaging method comprises six steps of chip fixing and bonding wire electrical connection, plastic sealing, glue removing, pin cutting ribs and stamping forming. The small volume SOT23-6, and a highly assembled LED lamp bead chip, and assisted by a six-step packaging process, the whole volume is smaller, the stability and reliability are high, the process is simple and simple, the processing efficiency is high, the driving chip and the lamp bead chip centralized leads are short and not easy to collapse, and the broken chip rate is low. 本发明公开了种用于LED显示的复合封装方法，封装方法包括芯片固晶和焊线电气连接、塑封、去胶、管脚切筋、冲压成型六个步骤，选用小体积的SOT23-6的支架再加上高度集合的LED灯珠芯片，辅以六步封装工艺，整体体积更小，稳定性可靠性高，工艺简单简捷加工效率高，驱动芯片与灯珠芯片集中引线短不易塌线，坏片率低。