A fast repetitive data block identification method based on 3D stacked memory
The invention discloses a fast repetitive data block identification method based on 3D stacked memory. The method comprises the following steps: sending a data block fingerprint to a 3D stacked memory; Searching and storing the fingerprints of the data blocks in the 3D stack memory; returning finger...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a fast repetitive data block identification method based on 3D stacked memory. The method comprises the following steps: sending a data block fingerprint to a 3D stacked memory; Searching and storing the fingerprints of the data blocks in the 3D stack memory; returning fingerprint retrieval results to that CPU by the 3D stack memory. The 3D stack memory is used to store data block fingerprints, 3D stack memory is formed by stacking a plurality of DRAM chips and a logic layer chip, and is connected through TSV technology. That logic layer accesses the memory layer through TSV without passing through a data bus, the speed is fast, unnecessary data movement on the bus is avoided, and the time for accessing the memory is reduced; The invention classifies the data fingerprints, divides the memory chip, stores each class of fingerprints in one division, embeds a plurality of calculation units and a route in the logic layer, and routes the data fingerprints to each calculation unit, avoids th |
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