Device for bonding LED bare chips to lead frame bands

In one embodiment, an LED bulb comprises a plurality of metal lead frame bands which at least comprise the first band, the second band and the third band. A bottom electrode of a first LED bare chip is electrically and thermally coupled to the top surface of the first band, a bottom electrode of a s...

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Bibliographische Detailangaben
Hauptverfasser:	PAUL SCOTT MARTIN, ALBRECHT JOHANNES KRAUS, HUI LING PAN, SZE KUANG LEE, CHUNHENG KANG, LONG YIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO USESOR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	In one embodiment, an LED bulb comprises a plurality of metal lead frame bands which at least comprise the first band, the second band and the third band. A bottom electrode of a first LED bare chip is electrically and thermally coupled to the top surface of the first band, a bottom electrode of a second LED bare chip is electrically and thermally coupled to the top surface of the second band, a top electrode of the first LED bare chip is wire-bonded to the second band, and a top electrode of the second LED bare chip is wire-bonded to the third band, so that the first LED bare chip and the second LED bare chip are connected in series and in parallel; then, the bands are bent so that the LED bare chips can be in different directions and accordingly wide emission types can be obtained in a small space; then, the bands are sealed in the heat-conducting bulb with an electrical lead. 在个实施例中，LED灯泡包括多个金属引线框架带，其包括至少第带、第二带和第三带。第LED裸片使其底部电极电且热耦接至第带的顶表面。第二LED裸片使其底部电极电且热耦接至第二带的顶表面。第LED裸片的顶部电极线接合至第二带，并且第二LED裸片的顶部电极线接合至第三带