Stacked package heat transfer system and method

Systems and methods for improving heat distribution and heat removal efficiency in PoP semiconductor packages are provided. A PoP semiconductor package includes a first semiconductor package that is physically, communicably, and conductively coupled to a stacked second semiconductor package. A gap forms between the upper surface of the first semiconductor package and the lower surface of the second semiconductor package. Additionally, interstitial gaps form between each of the PoP semiconductor packages disposed on an organic substrate. A curable fluid material, such as a molding compound, maybe flowed both in the interstitial spaces between the PoP semiconductor packages and into the gap between the upper surface of the first semiconductor package and the lower surface of the second semiconductor package. 提供了用于改善PoP半导体封装中的热分布和热移除效率的系统和方法。PoP半导体封装包括第半导体封装，其物理地、可通信地且导电地耦合到堆叠的第二半导体封装。间隙形成在第半导体封装的上表面与第二半导体封装的下表面之间。另外，在设置在有机衬底上的每个PoP半导体封装之间形成空隙。诸如模塑料的可固化流体材料可以在PoP半导体封装之间的空隙空间中流动并且流入第半导体封装的上表面和第二半导体封装的下表面之间的间隙中。