TWO-COMPONENT PUTTY, METHOD FOR COATING A SUBSTRATE WITH SUCH PUTTY, SUBSTRATES COATED WITH SUCH PUTTY AND USE FOR SUCH PUTTY FOR IMPROVING EROSION RESISTANCE

The present invention relates to a two-component putty comprising (1) a base component and (2) a curing component, wherein the base component comprises: a polycarbonate diol having a hydroxyl number in the range of from 50 to 500 mg KOH/g; a further resin component having a hydroxyl number of at lea...

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Bibliographische Detailangaben
Hauptverfasser: FELKER JOHANNES, SEEGER DIRK
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The present invention relates to a two-component putty comprising (1) a base component and (2) a curing component, wherein the base component comprises: a polycarbonate diol having a hydroxyl number in the range of from 50 to 500 mg KOH/g; a further resin component having a hydroxyl number of at least 300 mg KOH/g; and an inorganic filler, wherein the curing component comprises a polyisocyanate, and wherein the amount of the inorganic filler is in the range of from 35 wt% to 60 wt%, based on the total weight of the putty, the putty contains less than 5 wt% of organic solvent, and the viscosityof the putty is in the range of from 30,000 mPa.s to 250,000 mPa.s. The present invention also relates to a method for coating a substrate by applying such putty and allowing the applied putty to cure. The invention further relates to a coated substrate obtainable by such method and the use of such two-component putty for improving erosion resistance of a substrate. 本发明涉及种双组分腻子,其包含(1)基础组分和(2)固化组分,其中基础组分包含:-羟值为50-500mg KO