A C-type device wire clamp

The present invention relate to the technical field of wire clamps, and more particularly, to a C-type device wire clamp. A C-type equipment wire clamp comprise a wire clamp body and a copper-aluminumcomposite plate connected with that wire clamp body, wherein a mounting hole is arranged on the copp...

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Hauptverfasser: WANG LEI, LI WEIFENG, HUANG GUOHUI, LIAO SONGWEN, DENG RUIQIU, FENG JINTIAN, LIN CAIJIAN, CHEN ZHIZHAO, LIU ZEHUI, LIU JIANQIANG, FANG GUOWEI, ZHOU JIEWEN, FENG JINHONG, LIANG RUJIU, YANG JINGBIN, LIN QUNZHEN, LI WEIJIE, ZHANG WEILIANG, HUANG XUEJIA, SU WEIZHI, FENG GUOQUAN, WU XIAOQING, YE JIHUA
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention relate to the technical field of wire clamps, and more particularly, to a C-type device wire clamp. A C-type equipment wire clamp comprise a wire clamp body and a copper-aluminumcomposite plate connected with that wire clamp body, wherein a mounting hole is arranged on the copper-aluminum composite plate, and a fastening device for connecting and fasten wires is arranged onthe wire clamp body. The upper layer of the copper-aluminum composite plate is an aluminum plate, the lower layer of the copper-aluminum composite plate is a copper plate, and the aluminum plate and the copper plate are integrally formed. The invention has simple structure and avoids the problems that the wire clamp is butted with the copper equipment and the surface electrooxidation corrosion ofthe wire clamp directly causes the contact resistance of the equipment to increase greatly, seriously affects the operation of the line, and even directly burns the equipment and the like when the wire clamp is operated for a l