Lifting needle system, vacuum reaction chamber and semiconductor processing equipment
The embodiment of the invention discloses a lifting needle system, a vacuum reaction chamber and a semiconductor processing equipment. The lifting needle system comprises a focus ring, an electrostatic chuck, a focus ring lifting device and a wafer lifting needle jacking device. The focus ring lifti...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the invention discloses a lifting needle system, a vacuum reaction chamber and a semiconductor processing equipment. The lifting needle system comprises a focus ring, an electrostatic chuck, a focus ring lifting device and a wafer lifting needle jacking device. The focus ring lifting device comprises a focus ring thimble and a first lifting driving device, wherein the first lifting driving device drives the focus ring thimble to rise or fall for lifting or lowering the focus ring. The focus ring lifting device comprises a focus ring thimble and a first lifting driving device.The wafer lifting device comprises a wafer ejector and a second lifting driving device, wherein the second lifting driving device drives the wafer ejector to lift or lower the wafer placed on the focusing ring. The second lifting driving device drives the wafer ejector to lift or lower the wafer. The system, the vacuum reaction chamber and the equipment of the invention can improve the abnormal maintenance efficiency. Th |
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