Process for molding scale wafer smooth plastic brush wires
The invention discloses a process for molding scale wafer smooth plastic brush wires. The process comprises the following steps: 1, adding 1-45 percent of mica powder having a proper fineness into 55-99 percent of PBT (PET) resin; 2, stirring and mixing, and preparing masterbatches from the mixture...
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| creator | YANG BAIRONG |
| description | The invention discloses a process for molding scale wafer smooth plastic brush wires. The process comprises the following steps: 1, adding 1-45 percent of mica powder having a proper fineness into 55-99 percent of PBT (PET) resin; 2, stirring and mixing, and preparing masterbatches from the mixture by adopting a plastic granulator; 3, adding 1-50 percent of the masterbatches into the PBT (PET) resin; 4, drying by adopting a dryer, and uniformly mixing through a mixer; and 5, preparing brush wires by adopting an extrusion drawbench, wherein drying is carried out at the temperature of 125-140 DEG C for 3.8-4.2 hours by adopting the dryer in the step 4. According to the method, fine mica powder is added into drawing raw materials, and the wires have scale and wafer shaped appearance by utilizing the scale shape and smooth performance of the mica powder (especially sericite); the appearance has a pig shape; and the brush wires have unique smoothness, dispersion and verticality performance.
本发明公开了种鳞片晶片丝滑塑胶刷丝的成型工艺， |
| format | Patent |
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本发明公开了种鳞片晶片丝滑塑胶刷丝的成型工艺，</description><language>chi ; eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; MAKING GRANULES OR PREFORMS ; PERFORMING OPERATIONS ; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED ; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190111&DB=EPODOC&CC=CN&NR=109176948A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190111&DB=EPODOC&CC=CN&NR=109176948A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANG BAIRONG</creatorcontrib><title>Process for molding scale wafer smooth plastic brush wires</title><description>The invention discloses a process for molding scale wafer smooth plastic brush wires. The process comprises the following steps: 1, adding 1-45 percent of mica powder having a proper fineness into 55-99 percent of PBT (PET) resin; 2, stirring and mixing, and preparing masterbatches from the mixture by adopting a plastic granulator; 3, adding 1-50 percent of the masterbatches into the PBT (PET) resin; 4, drying by adopting a dryer, and uniformly mixing through a mixer; and 5, preparing brush wires by adopting an extrusion drawbench, wherein drying is carried out at the temperature of 125-140 DEG C for 3.8-4.2 hours by adopting the dryer in the step 4. According to the method, fine mica powder is added into drawing raw materials, and the wires have scale and wafer shaped appearance by utilizing the scale shape and smooth performance of the mica powder (especially sericite); the appearance has a pig shape; and the brush wires have unique smoothness, dispersion and verticality performance.
本发明公开了种鳞片晶片丝滑塑胶刷丝的成型工艺，</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>MAKING GRANULES OR PREFORMS</subject><subject>PERFORMING OPERATIONS</subject><subject>PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED</subject><subject>RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAKKMpPTi0uVkjLL1LIzc9JycxLVyhOTsxJVShPTEstUijOzc8vyVAoyEksLslMVkgqKi3OUCjPLEot5mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hgaWhuZmliYWjsbEqAEAg2YvQA</recordid><startdate>20190111</startdate><enddate>20190111</enddate><creator>YANG BAIRONG</creator><scope>EVB</scope></search><sort><creationdate>20190111</creationdate><title>Process for molding scale wafer smooth plastic brush wires</title><author>YANG BAIRONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN109176948A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>MAKING GRANULES OR PREFORMS</topic><topic>PERFORMING OPERATIONS</topic><topic>PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED</topic><topic>RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>YANG BAIRONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANG BAIRONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Process for molding scale wafer smooth plastic brush wires</title><date>2019-01-11</date><risdate>2019</risdate><abstract>The invention discloses a process for molding scale wafer smooth plastic brush wires. The process comprises the following steps: 1, adding 1-45 percent of mica powder having a proper fineness into 55-99 percent of PBT (PET) resin; 2, stirring and mixing, and preparing masterbatches from the mixture by adopting a plastic granulator; 3, adding 1-50 percent of the masterbatches into the PBT (PET) resin; 4, drying by adopting a dryer, and uniformly mixing through a mixer; and 5, preparing brush wires by adopting an extrusion drawbench, wherein drying is carried out at the temperature of 125-140 DEG C for 3.8-4.2 hours by adopting the dryer in the step 4. According to the method, fine mica powder is added into drawing raw materials, and the wires have scale and wafer shaped appearance by utilizing the scale shape and smooth performance of the mica powder (especially sericite); the appearance has a pig shape; and the brush wires have unique smoothness, dispersion and verticality performance.
本发明公开了种鳞片晶片丝滑塑胶刷丝的成型工艺，</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING MAKING GRANULES OR PREFORMS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Process for molding scale wafer smooth plastic brush wires |
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